Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)

Materials Research Society of Korea (한국재료학회)
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THE INFLUENCE OF PEEL STRENGTH BETWEEN UBM LAYERS AND POLYIMIDE ON THE SHEAR STRENGTH OF SOLDER BUMPS

  • S. J. Heo (Dept. of Mat. Eng., Hanyang Univ) ;
  • Kim, Y.-H. (Dept. of Mat. Eng., Hanyang Univ) ;
  • B. J. Han (Anam Semiconductor Co Ltd., Seoul) ;
  • J. H. Yoon (Anam Semiconductor Co Ltd., Seoul)
  • Published : 1998.08.01
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