DIRECT WAFER BONDING BETWEEN DIFFERENT SEMICONDUCTOR MATERIALS AND APPLICATION OF SEMICONDUCTOR LASERS

  • Chung, T.R. (Research Center for Advanced Scienceand Technology, The University of Tokyo) ;
  • Hosoda, N. (Research Center for Advanced Scienceand Technology, The University of Tokyo) ;
  • Suga, T. (Research Center for Advanced Scienceand Technology, The University of Tokyo)
  • Published : 1998.08.01