DIRECT WAFER BONDING BETWEEN InP WAFER AND $Si_3N_4/InP$

  • Kim, Sun-Woon (Div. of Mat. Sci. & Eng., Korea Univ.) ;
  • Shin, D.S. (Div. of Mat. Sci. & Eng., Korea Univ.) ;
  • Lee, J.Y. (Dept. of Mat. Sci. & Eng., KAIST) ;
  • Choi, I.H. (Div. of Mat. Sci. & Eng., Korea Univ.)
  • Published : 1998.08.01