대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 1998년도 하계학술대회 논문집 D
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- Pages.1468-1470
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- 1998
Au/Pl/Au구조의 유기박막 절연성에 관한 연구
A Study on the Insulation Characteristics of Organic Thin Films of Au/Pl/Au structure
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전동규
(동신대학교 대학원 전기전자공학과) ;
- 김영근 (동신대학교 대학원 전기전자공학과) ;
- 조제황 (동신대학교 공과대학 전기전자공학과) ;
-
이경섭
(동신대학교 공과대학 전기전자공학과) ;
- 최영일 (조선공업전문대학 전자과)
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Chon, D.K.
(Dept. of Electrical & Electronic Eng. Dongshin Univ. grad.) ;
- Kim, Y.K. (Dept. of Electrical & Electronic Eng. Dongshin Univ. grad.) ;
- Cho, C.H. (Dept. of Electrical & Electronic Eng. Dongshin Univ.) ;
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Lee, K.S.
(Dept. of Electrical & Electronic Eng. Dongshin Univ.) ;
- Choi, Y.I. (Dept. of Electronic Eng. Chosun Industrial Junior college)
- 발행 : 1998.07.20
초록
Using a solution of polyamic acid salt obtained in combination with polyimide acid, we successfully prepared thermally stable multilayers(41, 35, 31 layers) films disilane-containing polyimide by Langmuir-Blodgett(LB) technique. We studied the electrically phenomena occurring at the metal(Au)/polyimide(Pl) LB film/metal(Au). Also, we then examined the of Pl LB films by means of current-voltage (I-V) and resistance measurement.
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