Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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A Study on the Insulation Characteristics of Organic Thin Films of Au/Pl/Au structure

Au/Pl/Au구조의 유기박막 절연성에 관한 연구

  • Chon, D.K. (Dept. of Electrical & Electronic Eng. Dongshin Univ. grad.) ;
  • Kim, Y.K. (Dept. of Electrical & Electronic Eng. Dongshin Univ. grad.) ;
  • Cho, C.H. (Dept. of Electrical & Electronic Eng. Dongshin Univ.) ;
  • Lee, K.S. (Dept. of Electrical & Electronic Eng. Dongshin Univ.) ;
  • Choi, Y.I. (Dept. of Electronic Eng. Chosun Industrial Junior college)
  • 전동규 (동신대학교 대학원 전기전자공학과) ;
  • 김영근 (동신대학교 대학원 전기전자공학과) ;
  • 조제황 (동신대학교 공과대학 전기전자공학과) ;
  • 이경섭 (동신대학교 공과대학 전기전자공학과) ;
  • 최영일 (조선공업전문대학 전자과)
  • Published : 1998.07.20
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Abstract

Using a solution of polyamic acid salt obtained in combination with polyimide acid, we successfully prepared thermally stable multilayers(41, 35, 31 layers) films disilane-containing polyimide by Langmuir-Blodgett(LB) technique. We studied the electrically phenomena occurring at the metal(Au)/polyimide(Pl) LB film/metal(Au). Also, we then examined the of Pl LB films by means of current-voltage (I-V) and resistance measurement.

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