한국정밀공학회:학술대회논문집 (Proceedings of the Korean Society of Precision Engineering Conference)
- 한국정밀공학회 1997년도 추계학술대회 논문집
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- Pages.899-902
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- 1997
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- 2005-8446(pISSN)
연삭가공에서 이동열원에 의한 온도 분포
A Moving Heat Source Caused by Temperature Distribution in Grinding Process
- Kwak, T. K. (Mech. Eng. Dept., PKNU) ;
- Ha, M. K. (Prof. Mech. Eng. Dept., PKNU) ;
- Koo, Y. (Prof. Mech. Eng. Dept., PKNU) ;
- Kwak, J. S. (Prof. Mech. Eng. Dept., PKNU)
- 발행 : 1997.10.01
초록
The heat generated during surface grinding process can lead to elevate a grinding temperature, which cause the thermal damage to the workpiece material. Because of this reason, it is important to be able to predict the temperature which is occurred during grinding. The process parameters, therefore, should be adjusted properly to yield the acceptable workpiece temperature. In this study, we conducted an experimentation to obtain and also to analyze the temperature distribution of the workpiece with accordance in varying the grinding condition. For measuring the workpiece temperature, thermocouples of the CA type were inserted into the predetermined locations of the workpiece.