멀티블레이드를 이용한 Micro BGA의 초정밀 싱귤레이션

Ultra-precision Singulation of Micro BGA using Multi Blade

Singulation is a process that cutting for separating a chip individually after finishing packaging process(micro BGA etc.). For shortening the process of singulation, we proposed the singulation using multi-blade. This paper introduced a method of multi-blade singulation and investigated a result of application and problems. The efficiency of singulation process was improved five times better than the single-blade by the singulation using Multi-blade.