3차원 강소성 유한요소해석을 사용한 전자부품의 정밀단조공정 설계

In order to increase the productivity of electrical parts, manufacturing processes using progressive die have been widely used in the industry. If closed-die forging process may be included in the series of the forming process, however, there arise many problems in the die design, such as determination of blank size, feeding method and formability, etc. For the proper design of a process, a prediction of the process is requred to obtain many design parameters. In this work, three-dimensional rigid-plastic finite element analysis is carried out to simulate precision forging process. The forging process of STEM, a part of photo pick-up hologram device, is simulated with the two types of processes, open die forging and semi-closed die forging, respectively. Form the results of analyses, the forging processes can be predicted successfully, which enables to design appropriately the die and the process.