Proceedings of the Korean Society of Precision Engineering Conference (한국정밀공학회:학술대회논문집)
- 1997.04a
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- Pages.35-40
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- 1997
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- 2005-8446(pISSN)
Dynamic Analysis and Control of Bonding Process for LOC Die Bonder
LOC Die Bonder의 접합 공정 해석 및 접합력 제어
Abstract
The present study considers the analysis and control of the bonding process for a LOC DIe Bonder. A mathematical model for describing the bonding process is developed and proved by experiments. A feedback scheme is also applied for system in order to ensure the robustness of the bonding force control. The theoretical and experimental results are proved useful for the design and control of the LOC Die Bonder.