Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 1996.07c
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- Pages.1946-1949
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- 1996
Experimental Analysis on the Anodic Bonding with Evaporated Glass Layer
- Choi, Woo-Beom (Division of Electronics and Information Technology, Korea Institute of Science and Technology) ;
- Ju, Byeong-Kwon (Division of Electronics and Information Technology, Korea Institute of Science and Technology) ;
- Lee, Yun-Hi (Division of Electronics and Information Technology, Korea Institute of Science and Technology) ;
- Jeong, Seong-Jae (Information Display Research Institute, Orion Electric Co.) ;
- Lee, Nam-Yang (Information Display Research Institute, Orion Electric Co.) ;
- Koh, Ken-Ha (Information Display Research Institute, Orion Electric Co.) ;
- Haskard, M.R. (Microelectronics Centre, Univ. of South Australia) ;
- Sung, Man-Young (Department of Electrical Engineering, Korea Univ.) ;
- Oh, Myung-Hwan (Division of Electronics and Information Technology, Korea Institute of Science and Technology)
- Published : 1996.07.22
Abstract
We have performed silicon-to-silicon anodic bonding using glass layer deposited by electron beam evaporation. Wafers can be bonded at
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