진공증착중합법으로 제작된 폴리이미드의 분자구조분석

Moleculer structure analysis of fabricated polyimide by vapor deposion polymerization

PoIyimide thin films fabricated at substrate temperature $20^{\circ}C$, $40^{\circ}C$and $70^{\circ}C$ by vapor deposition polymerization method were confirmed by FT-IR spectra. It is found that deposition rate decreas according as increasing substrate temperature. Defusion depth of evaporation Al at which thin films be used for an insulating films between layers of semiconductor were about $300{\AA}$.