Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)

The Korean Institute of Electrical Engineers (대한전기학회)
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Mechanical and Thermal Characteristics of Cu Particle Filled Epoxy Resin Composites for EMI Shielding

CU 분말 충전된 전자파 차폐용 에폭시 수지 복합체의 기계적, 열적특성

  • 조영신 (서울시립대학교 화학공학과) ;
  • 심미자 (서울시립대학교 생명과학과) ;
  • 김상욱 (서울시립대학교 화학공학과)
  • Published : 1996.07.22
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Abstract

The experimental study was carried out to investigate the effects of metallic particulate filler on the mechanical properties and the thermal properties of epoxy resin system filled with Cu powder. As Cu contents increased, the tensile strength, surface hardness and $T_d$ decreased. $T_g$ increased and decreased at 300 phr. $E_d$ decreased and increased at 200 phr, because the thermal conducting path of filler was formed and dissipated thermal stress.

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