대한전기학회:학술대회논문집 (Proceedings of the KIEE Conference)
- 대한전기학회 1995년도 추계학술대회 논문집 학회본부
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- Pages.364-366
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- 1995
Ti/TiN Barrier 층을 갖는 Al 배선의 Electromigration 특성
A study on Electromigration characteristics in Al line with Ti/TiN Barrier Layer
- Choo, K.S. (Department of Electrical Engineering. Korea University) ;
- Shin, S.W. (Department of Electrical Engineering. Korea University) ;
- Chu, Eu-Gine (Department of Electrical Engineering. Korea University) ;
- Sung, Y.K. (Department of Electrical Engineering. Korea University)
- 발행 : 1995.11.18
초록
We investigated the Electromigration characteristics in Cu alloyed Al line and the effect of Ti/TiN barrier layer on the characteristics. Test structures were fabricated by wafer level and 50% failure times were tested in the condition of j= 2 MA/
키워드