Three-Dimensional Crystallizing $\pi$-Bondings and Creep of Metals

Creep of metals has been explained conventionally by dislocation climb and grain boundary sliding indiffusion controlled process. The reorienations of the atoms in the grain by three dimensional crystallizing $\pi$-bondings are visualized as grain rotatins during slow deformation, fold formatin at triple point, increased crevice dspace between grains. grain boundary sliding, grain boundary micration and formation of cracks at the grain boundaries . And also the rupture time and average creep strain rate are explained by the three-dimensional crystallizing $\pi$- bondings and they can be determined by uniaxial tensile test.