A Fabrication and Characteristic Estimation of Polycrystalline Silicon Structural Layer for Micromachining

미세가공용 다결정 실리콘 구조체의 제작 및 특성 평가

  • Kim, Hyoung-Dong (Dept. of Electronic Engineering, Seoul City University) ;
  • Pack, Seung-Ho (Dept. of Electronic Engineering, Seoul City University) ;
  • Lee, Seong-Jun (Dept. of Electronic Engineering, Seoul City University) ;
  • Kim, Chul-Ju (Dept. of Electronic Engineering, Seoul City University)
  • 김형동 (서울시립대학교 전자공학과) ;
  • 백승호 (서울시립대학교 전자공학과) ;
  • 이성준 (서울시립대학교 전자공학과) ;
  • 김철주 (서울시립대학교 전자공학과)
  • Published : 1995.07.20

Abstract

In this study, we confirmed that the crystallinity and the mechanical properties of polycrystalline Silicon(poly-Si) deposited on the poly-oxide are better than those of poly-Si on the conventional sacrificial layers that is CVD oxide layer or PSG. But the etch rate of poly-oxide is poor than that of the CVD oxide layer or PSG. Therefore, to make the best use of small stress and fast etch rate, we fabricated the double oxide layer; 10%-thick poly-oxide on 90%-thick CVD oxide or PSG. To estimate structure deformation by stress, we fabricated the test structures; cantilever. bridge and ring/beam structure and estimated by SEM. As the results, all structure is expressed the deformed structure by residual stress(tensile stress) and the deformation of the structure layer on the double oxide layer is small compared with that of the structure layer on the CVD oxide layer or PSG. And, the etch rate of the double oxide layer is enhanced compared with that of the poly-oxide.

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