Proceedings of the KIEE Conference (대한전기학회:학술대회논문집)
- 1994.11a
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- Pages.228-230
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- 1994
A Study on the Characteristics of Sputter ion Plating by ion Energy Analysis
이온 에너지 분석에 의한 Sputter Ion Plating의 동작 특성 연구
- Sung, Y.M. (Department of Electrical Engineering, Pusan National University) ;
- Lee, C.Y. (Department of Electrical Engineering, Pusan National University) ;
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Cho, J.S.
(Department of Electrical Engineering, Pusan National University) ;
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Park, C.H.
(Department of Electrical Engineering, Pusan National University)
- Published : 1994.11.18
Abstract
A Spotter ion Plating(SIP) system with a r. f. coil electrode and the Facing Target Sputter(FTS) source was designed for high-quality thin film formation. The rf discharge was combined with DC facing target sputtering in order to enhance ionization degree of a sputtered atoms. The discharge voltage-discharge characteristics curves of a FTS source could be characterized by the fern of
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