Proceedings of the Materials Research Society of Korea Conference (한국재료학회:학술대회논문집)
- 1994.11a
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- Pages.51-52
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- 1994
A Study on the Ta layer inserted as the diffusion barrier in copper metallization
Copper metallization에서 확산 장벽으로 삽입된 Ta 층에 대한 연구
Abstract
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