한국전기전자재료학회:학술대회논문집 (Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference)
- 한국전기전자재료학회 1994년도 추계학술대회 논문집
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- Pages.106-108
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- 1994
알루미늄 및 구리 박막에서의 표면전자이주
Surface Migration in Al and Cu Films
초록
Electromigration(EM) tests were carried out on Al and Cu films in HV systems to study surface migration. The Al films were made on oxidized silicon wafers by thermal evaporation, in-situ annealed at 300
키워드