The Dielectric Properties of Hexamethyldisiloxane Thin Films by Plasma Polymerization

플라즈마 중합법에 의한 Hexamethyldisiloxane 박막의 유전특성

Plasma polymerized thin films were prepared using an interelectrode capacitively coupled gas flow type reactor. Hexamethyldisiloxane was chosen as the monomer to be used. The dielectric properties of the thin films have been investigated with the changes of discharge power, heat treatment temperature and frequency. The relative dielectric constant was increased with an increasing of discharge power, but was decreased with an increasing of heat treatment temperature.