A Study on the fuse elements for the protection of a semiconductor using a ceramic substrate

세라믹 기판을 이용한 반도체 보호용 휴즈 엘리먼트에 관한 연구

This Paper presents some experimental result of current limiting and short circuit interruption behavior of thin copper film, 12${\mu}m$, 25${\mu}m$, 40${\mu}m$, 50${\mu}m$ on alumina substrate. and a fuse-link having elements of copper film provided with high-precision small hols with electrolytical process. Construction, fabrication, as well as the test circuitry built especially for the develoment of this fuse-links are explained below.