한국정밀공학회:학술대회논문집 (Proceedings of the Korean Society of Precision Engineering Conference)
- 한국정밀공학회 1991년도 추계학술대회 논문집
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- Pages.87-94
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- 1991
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- 2005-8446(pISSN)
초음파를 이용할 실리콘 칩 주위의 결함 검출에 관한 연구 - 화상처리에 의한 threshold value의 자동 결정법 -
A Study on the Defect Detection of Silicon-Chip Surrounding by Ultrasonic Wave - Automatic Determination Method of Threshold Value by Image Processing -
초록
This Paper is to aim the microdefect evaluation of semiconductor Package into a quantitative from NDI's image processing of ultrasonic wave. Accordingly, for the detection of delamination between the Joining condition of boundary microdefect of semiconductor packaga the result from sampling original image, histogramming, binary image or image processing of multinumerloal value is such as the follows. ([) The least limitation from the microdefect detection of the semiconductor package by surveying high ultrasonic wave seems to be about 0.8
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