건식식각장치에서 임피던스 측정과 비등방성 식각에 대한 연구

A STUDY OF RF IMPEDENCE MEASUREMENT AND ANISOTROPIC ETCHING

  • 김종식 (포항 공과 대학 전자전기공학과) ;
  • 김흥락 (포항 공과 대학 전자전기공학과) ;
  • 강봉구 (포항 공과 대학 전자전기공학과) ;
  • 권오대 (포항 공과 대학 전자전기공학과)
  • 발행 : 1989.11.25

초록

It is shown that fundamental plasma characteristic, which are sheath voltage and ion concentration, can be derived from measuring RF impedence. Plasma characteristics from this simple method are verified by direct measuring, to be reasonable. Using these values a new relation between isotropy and the ratio of sheath voltage to ion concentration is derived. For etch in which $CF_4$ is used, anisotropic etch can be achieved in its order $10^{-12}Vcm^3$ and isotropic etch in $10^{-12}Vcm^3$. These results are useful in every asymetric diode type etch system.

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